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| T. Grasser |
TU Wien |
Austria |
| S. Selberherr |
TU Wien |
Austria |
| V. Axelrad |
Sequoia Design Systems |
USA |
| T. Grasser |
TU Wien |
Austria |
| M. Hane |
NEC |
Japan |
| K. Ishikawa |
Renesas Technol. Corp. |
Japan |
| K. Mayaram |
Oregon State University |
USA |
| S. Odanaka |
Osaka University |
Japan |
| P. Oldiges |
IBM |
USA |
| G. Wachutka |
TU Munich |
Germany |
| R. Dutton |
Stanford University |
USA |
| S. Selberherr |
TU Wien |
Austria |
| K. Taniguchi |
Osaka University |
Japan |
| V. Axelrad |
Sequoia Design Systems |
USA |
| N. Goldsman |
University of Maryland |
USA |
| T. Grasser |
TU Wien |
Austria |
| A. Heringa |
Philips |
Netherlands |
| H. Jaouen |
ST Microelectronics |
France |
| S. Jones |
Bookham Technologies |
UK |
| J. Lorenz |
Fraunhofer IISB |
Germany |
| K. Matsuzawa |
Toshiba |
Japan |
| K. Mayaram |
Oregon State University |
USA |
| S. Odanaka |
Osaka University |
Japan |
| P. Oldiges |
IBM |
USA |
| Y.-K. Park |
Samsung |
Korea |
| M. Rudan |
University of Bologna |
Italy |
| W. Schoenmaker |
Magwel NV |
Belgium |
| G. Wachutka |
TU Munich |
Germany |
| C.-C. Wang |
TSMC |
Taiwan |